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Papers tagged with "Cooling Effect Etc"
Vol 7, Issue 7 (July 2021)
Mechanical Engineering
MODELLING & ANALYSIS OF COOLING OF ELECTRONIC PACKAGING USING SYNTHETIC JET IMPINGEMENT
Recently, The Cooling Process For Electronics Components Has Attracted Many Researchers And Several Techniques For Improving The Cooling Efficiency And Heat Transfer Rate Have Been Demonstrated. One Of The Best Efficient Techniques Is The I...
Satyajit.S.Dhore, Kanchan.D.Rajmane, Rahul.R.Gaherwar | Somnath.P.Ghavate, Suraj.D.Bhete | Abhishek.A.Shinde