NUMERICAL INVESTIGATION OF FIN EFFECTIVENESS OF HEAT SINK WITH DIFFERENT FINS |
Author(s): |
Bodi Dharmateja |
Keywords: |
CFD heat sink , Fin types. |
Abstract |
Thermal management of electronic components has been one of the primary areas of focus in advanced heat transfer research and development. This has been especially true in the evolution of microelectronics over the past several decades. Heat transfer behavior is complex, as heat is dissipated in the chip, conducted into the substrate and then transferred to the surroundings by some combination of thermal conduction, convection and radiation. The increase of power density in microelectronic packages has underlined the need for employing effective cooling devices and cooling methods to maintain the operating temperatures of electronic in this paper Various shapes and types of fins is Modelled and simulated using CFD software it is observed that there is significant increase In staggered fins. |
Other Details |
Paper ID: IJSARTV Published in: Volume : 8, Issue : 9 Publication Date: 9/3/2022 |
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