DESIGN AND ANALYSIS OF A CPU HEAT SINK USING METAL FORM TO ENHANCE HEAT TRANSFER RATE |
Author(s): |
Waghmare K.R |
Keywords: |
Metal Foam, Heat Sink, Thermal Design Power |
Abstract |
Metal-foam heat sinks made of copper or aluminium have proven to be appropriate for the cooling of high power electronic components with excellent cooling performance under forced convective conditions. The open-cell metal foam structure has the desirable qualities of a well-designed heat exchanger, i.e. a high specific solid–fluid interface surface area, good thermally conducting solid phase, and a tortuous coolant flow path to promote mixing. In this paper a heat sink designed for Processor Intel Core 2 duo E7500 is analysed experimentally. The sink is made from copper foam of 50 PPI and having porosity of 70 %.The dimensions of sink are derived from the datasheet provided by manufacturer. Performance of the sink is evaluated experimentally by placing it in forced convection setup. The results from the experiment are used to calculate the Nusselt’s Number, convective heat transfer coefficient and overall thermal resistance of heat sink. |
Other Details |
Paper ID: IJSARTV Published in: Volume : 2, Issue : 3 Publication Date: 3/14/2016 |
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