Modelling & Analysis Of Cooling Of Electronic Packaging Using Synthetic Jet Impingement

• Author(s):

  Satyajit.S.Dhore | Kanchan.D.Rajmane | Rahul.R.Gaherwar | Somnath.P.Ghavate | Suraj.D.Bhete | Abhishek.A.Shinde

• Keywords:

  Synthetic Jet, CFD, Cooling Effect Etc.

• Abstract:

  Recently, The Cooling Process For Electronics Components Has Attracted Many Researchers And Several Techniques For Improving The Cooling Efficiency And Heat Transfer Rate Have Been Demonstrated. One Of The Best Efficient Techniques Is The Introduction Of

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Other Details

• Paper id:

  IJSARTV7I750397

• Published in:

  Volume: 7 Issue: 7 July 2021

• Publication Date:

  2021-07-28

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