ANALYSIS AND OPTIMIZATION OF HEAT SINK WHICH USED FOR ELECTRONICS COMPONENT COOLING - REVIEW

• Author(s):

  Y Nandakishora | Nandyala Maheswra Reddy | Bathula Anjaiah, Gujarlamudi Prakash | Shaik Apsar, Kaja Venkata Radhakrishna

• Keywords:

  Heat Sink, Convection Heat Transfer, Heat Flux And Nusselt Number

• Abstract:

  Due To The Passage Of Current, The Electronic Components Generate Heat During The Course Of Their Operation. The Main Objective Is To Cool The Electronic Component By Removing The Heat Generated In Order To Ensure The Optimal Working Of The Component Heat

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Other Details

• Paper id:

  IJSARTV3I917469

• Published in:

  Volume: 3 Issue: 9 September 2017

• Publication Date:

  2017-09-22

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